SMT Process Engineer IV

Job Summary

The SMT Process Engineer IV is a senior-level technical expert responsible for optimizing and maintaining surface mount technology (SMT) processes to ensure high-quality, efficient, and cost-effective electronic assembly. This role involves advanced troubleshooting, process development, and continuous improvement initiatives across multiple SMT lines, often acting as a lead or mentor within the engineering team.

Job Responsibilities

• Lead the development, implementation, and optimization of complex SMT processes, including stencil printing, pick-and-place FUJI, reflow soldering, and automated optical inspection (AOI).

• Conduct advanced root cause analysis and implement corrective actions for SMT process defects (e.g., shorts, opens, voids, component placement issues) using statistical process control (SPC) and other analytical tools.

• Design and execute experiments (DOE) to improve SMT process robustness, yield, and throughput, focusing on new product introduction (NPI) and existing product enhancements.

• Collaborate with design engineering, manufacturing, and quality teams to ensure manufacturability (DFM) and resolve complex technical issues related to SMT assembly.

• Develop and maintain comprehensive process documentation, work instructions, and training materials for SMT operators and technicians.

• Evaluate and recommend new SMT equipment, materials, and technologies to enhance capabilities and improve manufacturing efficiency.

• Provide technical mentorship and guidance to junior engineers and manufacturing personnel on SMT best practices and problem-solving techniques.

• Drive continuous improvement projects using Lean manufacturing and Six Sigma methodologies to reduce waste and increase productivity within SMT operations.

• Monitor key performance indicators (KPIs) for SMT processes and present findings and recommendations to management.

• Ensure compliance with all relevant industry standards, safety regulations, and quality management systems (e.g., ISO, IPC).

Job Qualifications

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Master's degree preferred.

• 8+ years of progressive experience in SMT process engineering within a high-volume electronics manufacturing environment.

• Expert-level knowledge of SMT equipment (e.g., printers, pick-and-place machines, reflow ovens, AOI/SPI) from various manufacturers (e.g., Fuji, Universal, Koh Young, Agilent).

• Deep understanding of IPC-A-610 and J-STD-001 standards.

• Proficiency in statistical process control (SPC), design of experiments (DOE), and advanced problem-solving methodologies (e.g., 8D, Six Sigma).

• Strong analytical skills with the ability to interpret complex data and make data-driven decisions.

• Demonstrated ability to lead technical projects and drive process improvements.

• Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross-functional teams and mentor others.

• Experience with CAD/CAM software for SMT programming and DFM analysis is a plus.

• Ability to work effectively in a fast-paced, dynamic manufacturing environment.