SMT Principal Engineer

Job Summary

The SMT Principal Engineer I at Jabil, Inc. is a senior technical contributor responsible for leading advanced surface mount technology (SMT) process development, optimization, and continuous improvement initiatives across multiple manufacturing lines to ensure high-quality and efficient production of complex electronic assemblies.

Job Responsibilities

• Lead the development, implementation, and optimization of SMT processes, including paste printing, pick-and-place FUJI, reflow soldering, and post-reflow inspection (AOI, X-ray).

• Conduct in-depth analysis of SMT process data, identifying root causes of defects and implementing effective corrective and preventive actions.

• Develop and qualify new SMT equipment, materials, and processes, ensuring seamless integration into existing production environments.

• Provide expert technical guidance and mentorship to junior engineers and production teams on SMT best practices, troubleshooting, and process control.

• Collaborate with design engineering, supply chain, and quality departments to ensure manufacturability (DFM) of new products and resolve SMT-related design issues.

• Drive continuous improvement projects utilizing methodologies such as Six Sigma, Lean Manufacturing, and SPC to enhance SMT yield, throughput, and reliability.

• Author and maintain comprehensive SMT process documentation, including work instructions, process specifications, and failure analysis reports.

• Evaluate and implement new SMT technologies and industry trends to maintain Jabil's competitive edge and address evolving product requirements.

• Lead efforts in root cause analysis for complex SMT failures, implementing robust solutions to prevent recurrence.

• Represent Jabil in technical discussions with customers and suppliers regarding SMT process capabilities and new product introductions.

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Master's degree preferred.

• 8-12 years of progressive experience in SMT process engineering within a high-volume electronics manufacturing environment.

• Strong Knowledge of FUJI Setup, Nexim and Valor

• Demonstrated expertise in SMT equipment operation, programming, and maintenance, including printers, pick-and-place machines (e.g., Fuji, Programming, etc.), reflow ovens, and inspection systems (AOI, SPI, X-ray).

• In-depth knowledge of various soldering technologies, solder paste chemistries, and component packaging.

• Proven track record of leading process improvement projects and achieving significant yield and cost reductions.

• Strong analytical and problem-solving skills with a data-driven approach to decision-making (e.g., SPC, DOE).

• Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross-functional teams and external stakeholders.

• Proficiency in statistical analysis software (e.g., Minitab, JMP) and CAD software for DFM analysis.

• Familiarity with industry standards such as IPC-A-610 and J-STD-001.

• Ability to work independently and manage multiple complex projects simultaneously.